期刊刊名：黎明學報 　 卷期：23卷1期

篇名出版日期：2012年1月31日

作者：Feng-Yuan Chen,Rwei-Ching Chang,Ming-Jun Kuo,Shih-Bin Wang,陳?元,張瑞慶,郭銘駿,王士賓

語言：English

關鍵字：coefficient of thermal expansion,X-ray diffraction,titanium thin film,熱膨脹係,X-ray 擾射法,奈米鈦薄膜

被點閱次數：2次

閱讀時間：88sec

摘要：
The coefficient of thermal expansion (CTE) is an important factor of thermal stress for thin film materials since thermal stress arises from the mismatch of thermal expansion between the thin films and the underlying substrate. In this paper, the thermal expansion coefficient of titanium thin film with a thickness of 200nm between 23 and 300℃ was determined by nanoindentation, X-ray diffraction (XRD), sin2ψ technique and finite element method. The results show that the coefficient of thermal expansion between 23 and 300℃ is a curve between 11 and 17 ppm/℃, and the higher temperature the larger coefficient of thermal expansion. For the range between 23 and 100℃, the equivalent coefficient of thermal expansion (ECTE) is 19ppm/℃ as shifting the reference temperature to 68 ℃.

　　　　　[全文下載]